Modeling and Simulation Division

About us

The purpose of the Technical Group of Modeling and Simulation Division is to contribute to industrial circles by solving problems of powder using the latest computer simulation technique. The group is interested in academic subjects aiming to simulate powder behaviors which remain unsolved so far due to some difficulties, but also interested in enlightenment activities .for industrial fields. The many fields such as food, drug, cosmetics etc. have had few experiences of computer simulation. This group tries to enable them to improve product development and production process based on the simulation technology.

 Current level of technology, trend and activities in future

In a wet process, for particles with laminated film with a wet thickness of 100µm or more, the development of particle drying technology that aims to prevent segregation and the formation of crack is progressing. Attention is also given to ultra-thin film high speed coating technology and precision lamination technology on a substrate with surface irregularities and permeability.
Besides, in a dry process, the development of two-dimensional and three-dimensional lamination technology from micro to sub-micro particles by particle collision method is also progressing. However, improving the probability of particle adhering to the substrate and the control of lamination and particle filling structure are the challenges. Moreover, the development of the lamination of nanoparticles is expected in the future. Especially for the high-speed lamination of nanoparticles by directly connecting or merging the particles.
The common issues for both processes are controlling the orientation of anisotropic particles, developing a visualization/measurement method for the lamination process, and elucidating the lamination mechanism. In the future, it is important to develop a hybrid process for the lamination of dry and wet particles, precision multilayer lamination technology, 3D modeling technology, particle lamination simulation technology, materials informatics (MI), etc.

Conductor